Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5367766 | Ultra high density integrated circuit packages method | Carmen D. Burns, James W. Cady | 1994-11-29 |
| 5369056 | Warp-resistent ultra-thin integrated circuit package fabrication method | Carmen D. Burns, James W. Cady, Phillip R. Troetschel | 1994-11-29 |
| 5369058 | Warp-resistent ultra-thin integrated circuit package fabrication method | Carmen D. Burns, James W. Cady, Philip R. Troetschel | 1994-11-29 |