Issued Patents 1994
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5377077 | Ultra high density integrated circuit packages method and apparatus | — | 1994-12-27 |
| 5367766 | Ultra high density integrated circuit packages method | Jerry M. Roane, James W. Cady | 1994-11-29 |
| 5369056 | Warp-resistent ultra-thin integrated circuit package fabrication method | James W. Cady, Jerry M. Roane, Phillip R. Troetschel | 1994-11-29 |
| 5369058 | Warp-resistent ultra-thin integrated circuit package fabrication method | James W. Cady, Jerry M. Roane, Philip R. Troetschel | 1994-11-29 |
| 5279029 | Ultra high density integrated circuit packages method | — | 1994-01-18 |