Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5323952 | Bonding apparatus and testing apparatus of a bonded portion | Mituo Kato, Ryoichi Kajiwara, Setuo Sekine, Tokiyuki Seto | 1994-06-28 |
| 5304512 | Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process | Katsuo Arai, Sumio Okada, Takashi Ooba, Mayumi Kaneko | 1994-04-19 |