Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5304512 | Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process | Katsuo Arai, Sumio Okada, Kazuya Takahashi, Mayumi Kaneko | 1994-04-19 |