Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5299729 | Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device | Akira Matsushita | 1994-04-05 |
HK
Hidekazu KONISHI
Overall (1994): #125,572 of 165,921Top 80%
1
Patents 1994