Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5299729 | Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device | Hidekazu KONISHI | 1994-04-05 |
| 5285264 | Image reproduction apparatus with plural program processing | — | 1994-02-08 |