Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5328079 | Method of and arrangement for bond wire connecting together certain integrated circuit components | Ranjan J. Mathew, Arnold R. Smith | 1994-07-12 |
| 5296743 | Plastic encapsulated integrated circuit package and method of manufacturing the same | Hem Takiar | 1994-03-22 |