Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5339216 | Device and method for reducing thermal cycling in a semiconductor package | Peng-Cheng Lin | 1994-08-16 |
| 5325268 | Interconnector for a multi-chip module or package | Manoj Nachnani | 1994-06-28 |
| 5296743 | Plastic encapsulated integrated circuit package and method of manufacturing the same | Luu Thanh Nguyen | 1994-03-22 |