Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5375989 | Apparatus for plastic encapsulation of a semiconductor element | — | 1994-12-27 |
| 5366364 | Plastic molding apparatus | Sueyoshi Tanaka, Zyunzi Sakakibara | 1994-11-22 |
| 5336272 | Method for molding a semiconductor package on a continuous leadframe | Sueyoshi Tanaka | 1994-08-09 |
| 5281121 | Resin sealing apparatus | Sueyoshi Tanaka, Yutaka Morita | 1994-01-25 |