Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366364 | Plastic molding apparatus | Zyunzi Sakakibara, Yasutsugu Tsutsumi | 1994-11-22 |
| 5336272 | Method for molding a semiconductor package on a continuous leadframe | Yasutsugu Tsutsumi | 1994-08-09 |
| 5281121 | Resin sealing apparatus | Yasutsugu Tsutsumi, Yutaka Morita | 1994-01-25 |