Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5365400 | Heat sinks and semiconductor cooling device using the heat sinks | Noriyuki Ashiwake, Takahiro Daikoku, Shizuo Zushi, Satomi Kobayashi | 1994-11-15 |
| 5276586 | Bonding structure of thermal conductive members for a multi-chip module | Takahiro Daikoku, Tetsuya Hayashida, Noriyuki Ashiwake, Fumiyuki Kobayashi, Keizou Kawamura +1 more | 1994-01-04 |