Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5365400 | Heat sinks and semiconductor cooling device using the heat sinks | Takahiro Daikoku, Toshio Hatsuda, Shizuo Zushi, Satomi Kobayashi | 1994-11-15 |
| 5345107 | Cooling apparatus for electronic device | Takahiro Daikoku, Nobuo Kawasaki, Keizou Kawamura, Shizuo Zushi, Mitsuo Miyamoto +1 more | 1994-09-06 |
| 5276586 | Bonding structure of thermal conductive members for a multi-chip module | Toshio Hatsuda, Takahiro Daikoku, Tetsuya Hayashida, Fumiyuki Kobayashi, Keizou Kawamura +1 more | 1994-01-04 |