Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5375042 | Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit | Hideo Arima, Kenji Takeda | 1994-12-20 |
| 5276289 | Electronic circuit device and method of producing the same | Ryohei Satoh, Fumiyuki Kobayashi, Yutaka Watanabe, Tositada Netsu, Mitugu Shirai +3 more | 1994-01-04 |