Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5375042 | Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit | Kiyoshi Matsui, Kenji Takeda | 1994-12-20 |
| 5300735 | Interconnected multilayer boards and fabrication processes thereof | Hitoshi Yokono, Takashi Inoue, Naoya Kitamura, Haruhiko Matsuyama, Hitoshi Oka +4 more | 1994-04-05 |
| 5281151 | Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module | Kenji Takeda, Hideho Yamamura, Fumiyuki Kobayashi | 1994-01-25 |