Issued Patents 1994
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5371044 | Method of uniformly encapsulating a semiconductor device in resin | Isamu Yoshida, Junichi Saeki, Shigeharu Tsunoda, Kunihiko Nishi, Kenichi Imura +3 more | 1994-12-06 |
| 5358904 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Asao Nishimura +19 more | 1994-10-25 |
| 5357139 | Plastic encapsulated semiconductor device and lead frame | Akihiro Yaguchi, Asao Nishimura, Makoto Kitano, Ryuji Kohno, Nae Yoneda +1 more | 1994-10-18 |
| 5332922 | Multi-chip semiconductor package | Satoshi Oguchi, Masamichi Ishihara, Kazuya Ito, Gen Murakami, Toshiyuki Sakuta +7 more | 1994-07-26 |
| 5299092 | Plastic sealed type semiconductor apparatus | Akihiro Yaguchi, Asao Nishimura, Makoto Kitano, Junichi Arita | 1994-03-29 |
| 5296737 | Semiconductor device with a plurality of face to face chips | Asao Nishimura, Makoto Kitano, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno +1 more | 1994-03-22 |