Issued Patents 1994
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5359899 | Method for measuring adhesion strength of resin material | Naotaka Tanaka, Isao Hirose | 1994-11-01 |
| 5358904 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 1994-10-25 |
| 5357139 | Plastic encapsulated semiconductor device and lead frame | Akihiro Yaguchi, Makoto Kitano, Ryuji Kohno, Nae Yoneda, Ichiro Anjoh +1 more | 1994-10-18 |
| 5347429 | Plastic-molded-type semiconductor device | Ryuji Kohno, Makoto Kitano, Akihiro Yaguchi, Nae Yoneda | 1994-09-13 |
| 5299092 | Plastic sealed type semiconductor apparatus | Akihiro Yaguchi, Makoto Kitano, Ichiro Anjoh, Junichi Arita | 1994-03-29 |
| 5296737 | Semiconductor device with a plurality of face to face chips | Makoto Kitano, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno, Gen Murakami +1 more | 1994-03-22 |
| 5295045 | Plastic-molded-type semiconductor device and producing method therefor | Makoto Kitano, Akihiro Yaguchi, Nae Yoneda, Maya Obata, Ryuji Kohno +1 more | 1994-03-15 |
| 5293068 | Semiconductor device | Ryuji Kohno, Makoto Kitano, Akihiro Yaguchi, Sueo Kawai | 1994-03-08 |
| 5287284 | Product specification complex analysis system | Kazuhiro Sugino, Shingo Akasaka, Hiroko Imanishi, Junichi Saeki, Kunihiko Nishi | 1994-02-15 |