Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5300735 | Interconnected multilayer boards and fabrication processes thereof | Hitoshi Yokono, Hideo Arima, Takashi Inoue, Naoya Kitamura, Haruhiko Matsuyama +4 more | 1994-04-05 |
| 5280102 | Heat-resistant bonding materials | Haruhiko Matsuyama, Atsushi Honda, Teruki Aizawa | 1994-01-18 |