Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5376586 | Method of curing thin films of organic dielectric material | Solomon I. Beilin, Wen-chou Vincent Wang | 1994-12-27 |
| 5334804 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1994-08-02 |
| 5323520 | Process for fabricating a substrate with thin film capacitor | Michael G. Peters, Wen-chou Vincent Wang, Michael G. Lee, Solomon I. Beilin | 1994-06-28 |