Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5374196 | High-density/long-via laminated connector | — | 1994-12-20 |
| 5334804 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, William T. Chou, Connie M. Wong, Solomon I. Beilin | 1994-08-02 |