Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5346118 | Surface mount solder assembly of leadless integrated circuit packages to substrates | Yinon Degani, William L. Woods, Jr. | 1994-09-13 |
| 5307983 | Method of making an article comprising solder bump bonding | Chee Chong Wong | 1994-05-03 |