CW

Chee Chong Wong

AT AT&T: 1 patents #270 of 1,042Top 30%
📍 Newark, NJ: #4 of 8 inventorsTop 50%
🗺 New Jersey: #1,116 of 4,306 inventorsTop 30%
Overall (1994): #148,358 of 165,921Top 90%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5307983 Method of making an article comprising solder bump bonding Thomas Dixon Dudderar 1994-05-03