Issued Patents 1989
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4883718 | Flexible copper-clad circuit substrate | Masahiro Ohta, Yoshiho Snobe, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1989-11-28 |
| 4847349 | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines | Masahiro Ohta, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1989-07-11 |
| 4797466 | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine | Hideaki Oikawa, Masahiro Ohta, Shoji Tamai, Yoshiho Sonobe, Akihiro Yamaguchi | 1989-01-10 |
| 4795798 | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane | Shoji Tamai, Masahiro Ohta, Hideaki Oikawa, Kouji Ohkoshi, Akihiro Yamaguchi | 1989-01-03 |