Issued Patents 1989
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4883718 | Flexible copper-clad circuit substrate | Saburo Kawashima, Yoshiho Snobe, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1989-11-28 |
| 4847349 | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines | Saburo Kawashima, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1989-07-11 |
| 4839232 | Flexible laminate printed-circuit board and methods of making same | Moritsugu Morita, Kazuo Miyazaki, Akihiro Yamaguchi, Shoji Tamai, Kunio Nishihara | 1989-06-13 |
| 4831102 | Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine | Norimasa Yamaya, Nobuhito Koga, Akihiro Yamaguchi | 1989-05-16 |
| 4803258 | Thermoplastic aromatic polyether-pyridine and process for preparing same | Keizaburo Yamaguchi, Hideaki Oikawa, Kenichi Sugimoto, Akihiro Yamaguchi | 1989-02-07 |
| 4797466 | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine | Hideaki Oikawa, Saburo Kawashima, Shoji Tamai, Yoshiho Sonobe, Akihiro Yamaguchi | 1989-01-10 |
| 4795798 | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane | Shoji Tamai, Saburo Kawashima, Hideaki Oikawa, Kouji Ohkoshi, Akihiro Yamaguchi | 1989-01-03 |