AY

Akihiro Yamaguchi

MI Mitsui Toatsu Chemicals, Incorporated: 11 patents #1 of 264Top 1%
Overall (1989): #321 of 140,708Top 1%
11
Patents 1989

Issued Patents 1989

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
4883718 Flexible copper-clad circuit substrate Masahiro Ohta, Saburo Kawashima, Yoshiho Snobe, Shoji Tamai, Hideaki Oikawa 1989-11-28
4865795 Process for producing thermosetting resins Tetsunosuke Shiomura, Yoshiho Sonobe 1989-09-12
4847349 Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa +1 more 1989-07-11
4839232 Flexible laminate printed-circuit board and methods of making same Moritsugu Morita, Kazuo Miyazaki, Masahiro Ohta, Shoji Tamai, Kunio Nishihara 1989-06-13
4831102 Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine Norimasa Yamaya, Nobuhito Koga, Masahiro Ohta 1989-05-16
4808507 Electrophotographic photoreceptor 2-Phenyl-benzooxazole bisazo based Yasuyuki Yamada, Hisato Itoh, Tsutomu Nishizawa 1989-02-28
4808503 Electrophotographic receptors with charge generating azo-substituted tetraphenyl-thiophene or thiophene 1,1-dioxide Yasuyuki Yamada, Hisato Itoh, Tsutomu Nishizawa 1989-02-28
4803258 Thermoplastic aromatic polyether-pyridine and process for preparing same Keizaburo Yamaguchi, Hideaki Oikawa, Kenichi Sugimoto, Masahiro Ohta 1989-02-07
4801732 Preparation process of .alpha.-L-aspartyl-L-phenylalanine methyl ester Ryuichi Mita, Takeshi Oura, Chojiro Higuchi, Toshio Katoh 1989-01-31
4797466 High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine Hideaki Oikawa, Masahiro Ohta, Saburo Kawashima, Shoji Tamai, Yoshiho Sonobe 1989-01-10
4795798 High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane Shoji Tamai, Saburo Kawashima, Masahiro Ohta, Hideaki Oikawa, Kouji Ohkoshi 1989-01-03