PN

Perwaiz Nihal

IBM: 3 patents #34 of 1,444Top 3%
📍 Dublin, NH: #1 of 1 inventorsTop 100%
🗺 New Hampshire: #14 of 409 inventorsTop 4%
Overall (1989): #7,927 of 140,708Top 6%
3
Patents 1989

Issued Patents 1989

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
4866507 Module for packaging semiconductor integrated circuit chips on a base substrate Scott Jacobs, Burhan Ozmat, Henri D. Schnurmann, Arthur R. Zingher 1989-09-12
4817093 Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure Scott Jacobs, Maurice T. McMahon, Burhan Ozmat, Henri D. Schnurmann, Arthur R. Zingher 1989-03-28
4811082 High performance integrated circuit packaging structure Scott Jacobs, Burhan Ozmat, Henri D. Schnurmann 1989-03-07