Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4866507 | Module for packaging semiconductor integrated circuit chips on a base substrate | Scott Jacobs, Perwaiz Nihal, Burhan Ozmat, Arthur R. Zingher | 1989-09-12 |
| 4817093 | Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure | Scott Jacobs, Maurice T. McMahon, Perwaiz Nihal, Burhan Ozmat, Arthur R. Zingher | 1989-03-28 |
| 4811082 | High performance integrated circuit packaging structure | Scott Jacobs, Perwaiz Nihal, Burhan Ozmat | 1989-03-07 |