Issued Patents 1989
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4866507 | Module for packaging semiconductor integrated circuit chips on a base substrate | Perwaiz Nihal, Burhan Ozmat, Henri D. Schnurmann, Arthur R. Zingher | 1989-09-12 |
| 4828964 | Polyimide formulation for forming a patterned film on a substrate | William R. Brunsvold, Willard E. Conley, George L. Mack, David Paul Merritt, Ann M. Uptmor | 1989-05-09 |
| 4817093 | Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure | Maurice T. McMahon, Perwaiz Nihal, Burhan Ozmat, Henri D. Schnurmann, Arthur R. Zingher | 1989-03-28 |
| 4811082 | High performance integrated circuit packaging structure | Perwaiz Nihal, Burhan Ozmat, Henri D. Schnurmann | 1989-03-07 |