Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4868350 | High performance circuit boards | John P. Wiley | 1989-09-19 |
| 4810326 | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces | Suryadevara V. Babu, Vu Q. Bui, John A. Welsh | 1989-03-07 |
| 4797178 | Plasma etch enhancement with large mass inert gas | Vu Q. Bui, Kevin K. Chan, Vicki J. Malueg | 1989-01-10 |