SB

Suryadevara V. Babu

IBM: 1 patents #253 of 1,444Top 20%
📍 Potsdam, NY: #2 of 4 inventorsTop 50%
🗺 New York: #1,258 of 5,342 inventorsTop 25%
Overall (1989): #54,490 of 140,708Top 40%
1
Patents 1989

Issued Patents 1989

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
4810326 Interlaminate adhesion between polymeric materials and electrolytic copper surfaces Vu Q. Bui, Joseph G. Hoffarth, John A. Welsh 1989-03-07