Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283488 | Interconnect structure for insertion loss reduction in signal transmission and method thereof | Shun Cheng Chang, Jun Chou Yu, Cheng-Yu Lee, Chien-Chang Huang | 2025-04-22 |
| 11439007 | Nanotwinned structure | Bau-Chin Huang, Cheng-Hsien Yang, Cheng-Yu Lee | 2022-09-06 |
| 11430693 | Method for microstructure modification of conducting lines | Cheng-Yu Lee, Ping Chou Lin, Chih Pin Pan, Chih-Hao Chang | 2022-08-30 |
| 9744624 | Method for manufacturing circuit board | Jaen-Don Lan, Pin-Chung Lin, Chen-Rui Tseng, Yu-An Chen | 2017-08-29 |
| 9194822 | Adjustable fixture structure for 3-dimensional X-ray computed tomography | Cheng-Hsien Yang, Ling-Huang Hsu | 2015-11-24 |
| 9079272 | Solder joint with a multilayer intermetallic compound structure | Shih-Ju Wang, Yu-Hui Wu | 2015-07-14 |
| 8702878 | Method for controlling beta-tin orientation in solder joints | Bo Chen, Chih-Nan Chen | 2014-04-22 |
| 8207469 | Method for inhibiting electromigration-induced phase segregation in solder joints | Wei Wu | 2012-06-26 |
| 8092621 | Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints | Chi-Ming Lin | 2012-01-10 |
| 8049650 | Method for testing a high-speed digital to analog converter based on an undersampling technique | Chun-Wei Lin | 2011-11-01 |
| 7950565 | High speed ball shear machine | Han-Lin Chung | 2011-05-31 |
| 6602777 | Method for controlling the formation of intermetallic compounds in solder joints | Cheng-Heng Kao | 2003-08-05 |