Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11943874 | Stacking arrays and separator bodies during processing of component carriers on array level | Amin Nickkolgh, Ismadi Bin Ismail | 2024-03-26 |
| 11553599 | Component carrier comprising pillars on a coreless substrate | — | 2023-01-10 |
| 11160169 | Component carrier with component embedded in cavity and with double dielectric layer on front side | Christopher Katzko | 2021-10-26 |
| 9079272 | Solder joint with a multilayer intermetallic compound structure | Cheng-En Ho, Shih-Ju Wang | 2015-07-14 |
| 8823699 | Getting snapshots in immersible 3D scene recording in virtual world | Boas Betzler, Neil A. Katz, Gang Wang, Meng Ye, Zi Yu Zhu | 2014-09-02 |