Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342185 | Wafer bonding method and structure thereof | Shuai Guo, Jia Wen Wang, Tao Ding, Rui Xing, Xiao Jin Wang +1 more | 2022-05-24 |
| 10679854 | Wafer bonding method and structure thereof | Shuai Guo, Jia Wen Wang, Tao Ding, Rui Xing, Xiao Jin Wang +1 more | 2020-06-09 |