Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7830011 | Semiconductor element and wafer level chip size package therefor | Kentaro Nomoto, Hiroshi Saitoh, Takashi Sato, Toshio Ohashi, Yoshihiro Ohkura | 2010-11-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7830011 | Semiconductor element and wafer level chip size package therefor | Kentaro Nomoto, Hiroshi Saitoh, Takashi Sato, Toshio Ohashi, Yoshihiro Ohkura | 2010-11-09 |