Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398452 | Anodic bonding of a substrate of glass having contact vias to a substrate of silicon | Stefan WEINBERGER, Peter TILO | 2022-07-26 |
| 10825728 | Electrically conductive via(s) in a semiconductor substrate and associated production method | Sophia Dempwolf, Daniela Guenther, Uwe Schwarz | 2020-11-03 |
| 10199274 | Electrically conductive via(s) in a semiconductor substrate and associated production method | Sophia Dempwolf, Daniela Guenther, Uwe Schwarz | 2019-02-05 |
| 8129255 | Firm, insulating and electrically conducting connection of processed semiconductor wafers | — | 2012-03-06 |
| 8021906 | Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (MEMS) produced therewith | — | 2011-09-20 |
| 7790569 | Production of semiconductor substrates with buried layers by joining (bonding) semiconductor wafers | Andrej Lenz | 2010-09-07 |
| 7509875 | Electrical determination of the connection quality of a bonded wafer connection | — | 2009-03-31 |