Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8449675 | Semiconductor wafer with an epitaxially deposited layer, and process for producing the semiconductor wafer | Rupert Krautbauer, Gerhard Huettl, Erwin Mayer, Rainer Winkler | 2013-05-28 |
| 7790569 | Production of semiconductor substrates with buried layers by joining (bonding) semiconductor wafers | Roy Knechtel | 2010-09-07 |