Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368110 | Wafer assembly having alignment marks, method for forming same, and wafer alignment method | Guoliang YE, Xing Hu | 2025-07-22 |
| 11587838 | Grinding control method and device for wafer, and grinding device | Zhijun Zhang, Yifan Yang | 2023-02-21 |
| 11227760 | Wafer thinning method and wafer structure | — | 2022-01-18 |
| 11164840 | Chip interconnection structure, wafer interconnection structure and method for manufacturing the same | Guoliang YE, Jiaqi Wang | 2021-11-02 |