Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368110 | Wafer assembly having alignment marks, method for forming same, and wafer alignment method | Xing Hu, Hongsheng YI | 2025-07-22 |
| 12243905 | Method of forming metal grid, backside-illuminated image sensor and method of forming the same | — | 2025-03-04 |
| D1002302 | Bottle holder | — | 2023-10-24 |
| 11164834 | Wafer structure and method for manufacturing the same, and chip structure | Di ZHAN, Tianjian Liu | 2021-11-02 |
| 11164840 | Chip interconnection structure, wafer interconnection structure and method for manufacturing the same | Hongsheng YI, Jiaqi Wang | 2021-11-02 |
| D929737 | Storage container | — | 2021-09-07 |
| 10930619 | Multi-wafer bonding structure and bonding method | — | 2021-02-23 |
| 10203563 | Forming methods of liquid crystal layers, liquid crystal panels, and liquid crystal dripping devices | Bin Xiao | 2019-02-12 |