TT

T. J. Tseng

WE World Wiser Electrics: 1 patents #4 of 10Top 40%
Overall (All Time): #3,569,682 of 4,157,543Top 90%
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Patent #TitleCo-InventorsDate
6175497 Thermal vias-provided cavity-down IC package structure David C. H. Cheng 2001-01-16