Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546827 | Flip chip | Young Seok Shim, Hyung Ju Kim, Joo Hun Park | 2020-01-28 |
| 6581820 | Lead bonding method for SMD package | Jong-Sung Jung, Jong Tae Kim, Guem-Young Youn | 2003-06-24 |