Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546827 | Flip chip | Young Seok Shim, Hyung Ju Kim, Chang Dug KIM | 2020-01-28 |
| 7820468 | Stack type surface acoustic wave package, and method for manufacturing the same | Seung Hee Lee, Doo Cheol Park, Young Jin Lee, Sang Wook Park, Nam Hyeong Kim | 2010-10-26 |
| 7336017 | Stack type surface acoustic wave package, and method for manufacturing the same | Seung Hee Lee, Doo Cheol Park, Young Jin Lee, Sang Wook Park, Nam Hyeong Kim | 2008-02-26 |
| 7045385 | Method for fabricating surface acoustic wave filter packages and package sheet used therein | Tae Hoon Kim, Ju Weon Seo, Moon Soo Jeon | 2006-05-16 |
| 6928719 | Method for fabricating surface acoustic wave filter package | Tae Hoon Kim, Chan Wang Park, Jong Tae Kim | 2005-08-16 |
| 6670206 | Method for fabricating surface acoustic wave filter packages | Tae Hoon Kim, Chan Wang Park, Jae-Myung Kim | 2003-12-30 |