Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12022618 | Printed circuit board with stacked passive components | Chien-Te Chen, Cong Zhang, Yu Ying Tan, Chieh-Kai Yang | 2024-06-25 |
| 11557555 | Bumped pad structure | Ai Wen Wang, Chien-Te Chen, Chieh-Kai Yang | 2023-01-17 |
| 8411443 | Slidingly-engaged heat-dissipating assembly for memory and memory device having the same | Wei-Hau Chen, Tien-Chen Huang, Cheng-Hsien Kuo | 2013-04-02 |