JH

Jerwei Hsieh

WL Walsin Lihwa: 4 patents #6 of 51Top 15%
AM Asia Pacific Microsystems: 3 patents #3 of 32Top 10%
IC Instrument Technology Research Center: 1 patents #6 of 21Top 30%
Overall (All Time): #643,162 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
9676609 Integrated MEMS device 2017-06-13
9359193 Method for manufacturing an integrated MEMS device 2016-06-07
8916449 Package structure and substrate bonding method Hung-Lin Yin, Li-Yuan Lin 2014-12-23
7317575 Tunable dispersive optical system Kuen-Wey Shieh, Hsiao-Yu Chou 2008-01-08
7247247 Selective etching method Huai-Yuan Chu, Julius Ming-Lin Tsai, Weileun Fang 2007-07-24
7180144 Corner compensation method for fabricating MEMS and structure thereof Weileun Fang 2007-02-20
7088030 High-aspect-ratio-microstructure (HARM) Huai-Yuan Chu, Julius Ming-Lin Tsai, Weileun Fang 2006-08-08
6949396 Corner compensation method for fabricating MEMS and structure thereof Weileun Fang 2005-09-27