Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402243 | Circuit carrier board | Jer-Wei Hsieh | 2025-08-26 |
| 10156489 | Piezoresistive pressure sensor | Cheng-Yi Chiang, Yu-Che Huang | 2018-12-18 |
| 9553055 | Method for fabricating semiconductor devices having reinforcing elements | — | 2017-01-24 |
| 8916449 | Package structure and substrate bonding method | Jerwei Hsieh, Li-Yuan Lin | 2014-12-23 |