Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9070662 | Chip-scale packaging with protective heat spreader | Mihalis Michael | 2015-06-30 |
| 9035626 | Switching circuits for extracting power from an electric power source and associated methods | Anthony J. Stratakos, Michael D. McJimsey, Alexandr Ikriannikov, Artin Der Minassians, Kaiwei Yao +3 more | 2015-05-19 |
| 8946937 | Switching circuits for extracting power from an electric power source and associated methods | Anthony J. Stratakos, Michael D. McJimsey, Alexandr Ikriannikov, Artin Der Minassians, Kaiwei Yao +3 more | 2015-02-03 |
| 8942009 | Lead assembly for a flip-chip power switch | Efren M. Lacap | 2015-01-27 |
| 8933520 | Conductive routings in integrated circuits using under bump metallization | Efren M. Lacap | 2015-01-13 |
| 8907642 | Systems and methods for DC-to-DC converter control | Andrew J. Burstein, Sombuddha Chakraborty, Yali Xiong, Michael D. McJimsey, Trey Roessig +7 more | 2014-12-09 |
| 8872384 | Switching circuits for extracting power from an electric power source and associated methods | Anthony J. Stratakos, Michael D. McJimsey, Alexandr Ikriannikov, Artin Der Minassians, Kaiwei Yao +3 more | 2014-10-28 |
| 8710810 | Systems and methods for DC-to-DC converter control | Michael D. McJimsey, David Lidsky, Andrew J. Burstein, Giovanni Garcea, Jeremy M. Flasck +1 more | 2014-04-29 |
| 8680676 | Semiconductor package with under bump metallization routing | Efren M. Lacap | 2014-03-25 |
| 8664767 | Conductive routings in integrated circuits using under bump metallization | Efren M. Lacap | 2014-03-04 |
| 8368212 | Semiconductor package with under bump metallization routing | Efren M. Lacap | 2013-02-05 |
| 8169081 | Conductive routings in integrated circuits using under bump metallization | Efren M. Lacap | 2012-05-01 |
| 8085553 | Lead assembly for a flip-chip power switch | Efren M. Lacap | 2011-12-27 |
| 7989953 | Flip chip power switch with under bump metallization stack | Efren M. Lacap | 2011-08-02 |