Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11584638 | Reducing delamination in sensor package | — | 2023-02-21 |
| 8942009 | Lead assembly for a flip-chip power switch | Ilija Jergovic | 2015-01-27 |
| 8933520 | Conductive routings in integrated circuits using under bump metallization | Ilija Jergovic | 2015-01-13 |
| 8710664 | Wafer-level chip scale package | Subhash R. Nariani, Charles Nickel | 2014-04-29 |
| 8680676 | Semiconductor package with under bump metallization routing | Ilija Jergovic | 2014-03-25 |
| 8664767 | Conductive routings in integrated circuits using under bump metallization | Ilija Jergovic | 2014-03-04 |
| 8368212 | Semiconductor package with under bump metallization routing | Ilija Jergovic | 2013-02-05 |
| 8169081 | Conductive routings in integrated circuits using under bump metallization | Ilija Jergovic | 2012-05-01 |
| 8106516 | Wafer-level chip scale package | Subhash R. Nariani, Charles Nickel | 2012-01-31 |
| 8085553 | Lead assembly for a flip-chip power switch | Ilija Jergovic | 2011-12-27 |
| 7989953 | Flip chip power switch with under bump metallization stack | Ilija Jergovic | 2011-08-02 |
| 5939781 | Thermally enhanced integrated circuit packaging system | — | 1999-08-17 |
| 5905299 | Thermally enhanced thin quad flatpack package | — | 1999-05-18 |
| 5866941 | Ultra thin, leadless and molded surface mount integrated circuit package | — | 1999-02-02 |