Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8257795 | Nanoscale metal paste for interconnect and method of use | Guangyin Lei, Jesus Calata | 2012-09-04 |
| 6442033 | Low-cost 3D flip-chip packaging technology for integrated power electronics modules | Xingsheng Liu | 2002-08-27 |
| 5864459 | Process for providing a glass dielectric layer on an electrically conductive substrate and electrostatic chucks made by the process | Jaecheol Bang | 1999-01-26 |
| 5855676 | Tube lining apparatus | Jesus Calata | 1999-01-05 |