Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9913382 | Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap | Rajwant Sidhu | 2018-03-06 |
| 9017540 | Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards | Rajwant Sidhu, Carlos A. Lopez | 2015-04-28 |
| 8453322 | Manufacturing methods of multilayer printed circuit board having stacked via | Raj Kumar, Monte P. Dreyer, Michael J. Taylor | 2013-06-04 |