RS

Rajwant Sidhu

DG Ddi Global: 3 patents #1 of 7Top 15%
VL Viasystems Technologies Corp. L.L.C.: 2 patents #3 of 10Top 30%
📍 Brea, CA: #105 of 438 inventorsTop 25%
🗺 California: #106,790 of 386,348 inventorsTop 30%
Overall (All Time): #983,853 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
9913382 Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap Ruben Zepeda 2018-03-06
9017540 Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards Ruben Zepeda, Carlos A. Lopez 2015-04-28
8510941 Methods of manufacturing a printed wiring board having copper wrap plated hole 2013-08-20
8250751 Method of manufacturing a printed circuit board Paul Walker 2012-08-28
8156645 Method of manufacturing a multilayer printed wiring board with copper wrap plated hole 2012-04-17