Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6844616 | Multi-chip semiconductor package structure | Feng Lin, Yun-Sheng Chen | 2005-01-18 |
| 6458617 | Multi-chip semiconductor package structure | Feng Lin, Yun-Sheng Chen | 2002-10-01 |
| 6245598 | Method for wire bonding a chip to a substrate with recessed bond pads and devices formed | Tsung-Chieh Chen, Chun-Liang Chen | 2001-06-12 |
| 6220102 | Die-shear test fixture apparatus | — | 2001-04-24 |
| 6122822 | Method for balancing mold flow in encapsulating devices | — | 2000-09-26 |
| 6075281 | Modified lead finger for wire bonding | Tsung-Chieh Chen, Chuen-Jye Lin | 2000-06-13 |