Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410989 | Inter-chip alignment | Gary H. Bernstein, Anthony Hoffman, Scott Howard, Jason M. Kulick | 2019-09-10 |
| 10050027 | Quilt packaging system with mated metal interconnect nodules and voids | Scott Howard, Anthony Hoffman, Gary H. Bernstein, Jason M. Kulick | 2018-08-14 |
| 9620473 | Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment | Scott Howard, Anthony Hoffman, Gary H. Bernstein, Jason M. Kulick | 2017-04-11 |